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Product ID: 68502875
High Tg FR4 PCB for Industrial Circuit Applications
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Description
Engineered for demanding environments, this High Tg FR4 2 Layer PCB combines superior thermal stability with consistent electrical performance, making it ideal for industrial circuit applications where reliability and durability are non-negotiable. Unlike standard FR4 materials, our High Tg PCB Fr4 2 Layer utilizes advanced resin systems that maintain mechanical integrity at elevated temperatures—typically up to 170°C or higher—ensuring long-term operational stability in harsh conditions.
Designed with a focus on quality, each board features a 2-layer configuration using high-grade, low-loss dielectric material, minimizing signal distortion and maximizing signal integrity across high-frequency applications. The use of premium-grade glass fiber reinforcement enhances dimensional stability, while the high glass transition temperature (Tg) prevents warping, delamination, or degradation under thermal stress—critical for power electronics, automation systems, and embedded control units.
Key features include: excellent solder joint reliability, reduced coefficient of thermal expansion (CTE), enhanced resistance to moisture absorption, and compatibility with lead-free assembly processes. These boards meet RoHS compliance standards and are manufactured using precision lamination techniques that ensure uniform thickness and minimal impedance variation—ideal for mixed-signal and digital circuits requiring stable performance over time.
This 2 Layer PCB with High-quality materials is not just a component—it’s a foundational element in industrial design. Whether deployed in motor drives, medical devices, industrial sensors, or ruggedized communication modules, its robust construction supports continuous operation in extreme temperature cycles, vibration-prone environments, and high-humidity settings. Its optimized thermal management properties also reduce the need for additional cooling mechanisms, lowering overall system complexity and cost.
Designed with a focus on quality, each board features a 2-layer configuration using high-grade, low-loss dielectric material, minimizing signal distortion and maximizing signal integrity across high-frequency applications. The use of premium-grade glass fiber reinforcement enhances dimensional stability, while the high glass transition temperature (Tg) prevents warping, delamination, or degradation under thermal stress—critical for power electronics, automation systems, and embedded control units.
Key features include: excellent solder joint reliability, reduced coefficient of thermal expansion (CTE), enhanced resistance to moisture absorption, and compatibility with lead-free assembly processes. These boards meet RoHS compliance standards and are manufactured using precision lamination techniques that ensure uniform thickness and minimal impedance variation—ideal for mixed-signal and digital circuits requiring stable performance over time.
This 2 Layer PCB with High-quality materials is not just a component—it’s a foundational element in industrial design. Whether deployed in motor drives, medical devices, industrial sensors, or ruggedized communication modules, its robust construction supports continuous operation in extreme temperature cycles, vibration-prone environments, and high-humidity settings. Its optimized thermal management properties also reduce the need for additional cooling mechanisms, lowering overall system complexity and cost.
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