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      Product ID: 68590140

      Advanced Lead-Free Solder Paste for PCB Assembly

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      Description

      Overview

      Basic Info.

      • Model NO. MC-288-4
      • Melting Point 217-221ºC
      • Chemical Composition Sn96.5 Ag3.0 Cu0.5
      • Function Printing Application
      • Selling Units Single Item
      • Single Gross Weight 0.500 Kg
      • Storage Condition 2-10ºC
      • Powder Size T4: 20 - 38μm; T5: 15 - 25μm
      • Appearance Uniform Paste, No Flux Separation
      • Weight 500±5g
      • Customize Support OEM, ODM
      • Viscosity 190 ± 30PA·s (Can Be Customized as R
      • Product Name Solder Paste
      • Product Name2 No-Clean Solder Paste
      • Single Package Size 10X5X5cm
      • Specification 500g
      • Trademark APS
      • Origin Fujian, China
      • HS Code 3810100000
      • Production Capacity 500000/Month

      Packaging & Delivery

      • Package Size 30.00cm * 20.00cm * 10.00cm
      • Package Gross Weight 1.000kg

      Product Description

      Sn96.5 Ag3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly

      APS MC-288 (SAC305) lead-free no-clean solder paste is a lead-free and halogen-free solder paste suitable for ultra-fine process printing and reflow soldering. This solder paste has a wide process window and provides a surface mount technology solution for 01005-inch components. It offers excellent printing performance during 8 hours of use. With an outstanding reflow process window, it can still achieve good soldering results on Cu OSP boards even when using a high wetting curve. It has a good bond with printed dots of various sizes. Its excellent anti-collapse performance can effectively suppress the generation of solder balls. The solder joints have an excellent appearance and are easy to visually inspect. The void performance reaches IPC CLASS 3 level and the IPC flux classification is ROL0 level, ensuring the environmental friendliness and reliability of the product.

      Sn96.5 AG3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly

      Specification

      • product name solder paste
      • Place of Origin China
      • Fujian
      • Brand Name APS
      • Model Number MC-288
      • Type lead-free solder paste
      • Material Sn96.5 Ag3.0 Cu0.5
      • Application This solder paste is suitable for standard-pitch and ultra-fine-pitch screen printing applications. The printing speed ranges from 12.5mm/s to 100mm/s. A standard screen with a thickness of 0.08mm - 0.15mm is used. Depending on the printing speed, the squeegee pressure should also fluctuate within the recommended pressure range. The higher the printing speed, the greater the squeegee pressure. The wide reflow curve gives this product high soldering performance, excellent appearance, and fewer defects.

      Storage

      Store at 2 - 10ºC and use within 6 months from the production date. Ensure low-temperature transportation during shipping. Before opening the lid for use, make sure to bring the solder paste back to room temperature to prevent water vapor from condensing on the solder paste.

      Company Information

      Sn96.5 AG3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly

      Xiamen Aibeisen Electronics Co., Ltd. was established in 2005. It is a National High-tech Enterprise specializing in the research, development, production, sales, and technical services of electronic industrial adhesives, thermal interface materials, and electronic soldering materials. Our company collaborates with both the Institute of Chemistry, Chinese Academy of Sciences and the College of Materials Science and Engineering, Xiamen University, jointly establishing an industry-academia-research platform. It also recruits Ph.D. and graduate students from the two research institutes as key technical personnel for the R&D team. With nearly 18 years of development, the company boasts a highly skilled and experienced R&D team, focusing on the research, development, and production of electronic industrial adhesives, thermal interface materials, and soldering materials. It provides customers with solutions, including product development, simulation testing, and adhesive application processes.

      Sn96.5 AG3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly Sn96.5 AG3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly Sn96.5 AG3.0 Cu0.5 Advanced Lead-Free Solder Paste for PCB Assembly

      FAQ

      1. Are you trade company or manufacturer? We are manufacturer.
      2. How can we guarantee quality? Always a pre-production sample before mass production; Always final Inspection before shipment;
      3. What can you buy from us? Thermal Gap Pad, Thermal Gel, Thermal Grease, Electronic Adhesive, Soldering Materials.
      4. Why should you buy from us not from other suppliers? Xiamen Aibeisen Electronics was founded in 2005. It is a National High-tech Enterprise specializing in the research, development, production, sales and technical services of electronic adhesives, thermally conductive materials and soldering mateterials.
      5. What services can we provide? Accepted Delivery Terms: FOB, CIF, EXW; Accepted Payment Currency: USD, CNY; Accepted Payment Type: T/T, L/C, Credit Card, Western Union, Cash, Escrow; Language Spoken: English, Chinese.

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