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      Product ID: 68590114

      Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics

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      Description

      Basic Info.

      • Model NO. Best Solder Paste for SMD
      • Type Solder Paste
      • Melting Point <200℃
      • Chemical Composition Sn-Pb
      • Function Make the Liquid Solder Flow
      • Application SMT
      • Manufacturing Method Smelting
      • Alloy Tin Lead
      • Powder Size Type 3: 25 to 45 Microns
      • Powder Size 2 Type 4: 20 to 38 Microns
      • Flux No Clean Flux
      • Alloy 2 Sn63pb37
      • Alloy 3 Sn60pb40
      • Alloy 4 Sn55pb45
      • Alloy 5 Sn50pb50
      • Packing Jar
      • Packing 2 Syringe
      • Shipping Courier / Air Freight
      • Shelf Life 6months
      • Storage 0 to 10 Degree Celsius
      • Application 2 for SMD Components Soldering
      • Application 3 for Electronics SMT Soldering
      • Transport Package Foam Box
      • Specification 100g to 1000g
      • Trademark XF Solder
      • Origin China
      • HS Code 3810100000
      • Production Capacity 30tons/Month

      Packaging & Delivery

      • Package Size 10.00cm * 10.00cm * 10.00cm
      • Package Gross Weight 1.000kg

      Product Description

      Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics

      We produce different types of solder paste:

      • Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
      • Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
      Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics

      Introduction to Tin Solder Products

      Tin solder is a widely used material in the electronics industry for joining electrical components. Our company offers a range of high-quality tin solder products, including solder wire, solder bar, and solder paste, to meet the diverse needs of our customers.

      Solder Wire

      Our solder wire is made from a high-purity tin and lead alloy, with a rosin flux core. The rosin flux is a natural, non-corrosive flux that cleans and prepares the surface to be soldered, ensuring a strong and reliable bond. Our solder wire comes in different diameters, from 0.5mm to 2.0mm, to suit various applications.

      Solder Bar

      Our solder bar is made from a high-purity tin and lead alloy, with a melting point of 183ºC. It is ideal for use in manual and automated soldering processes, and provides excellent wetting and flow properties. Our solder bar comes in different weights and sizes, from 100g to 1kg, to suit different soldering needs.

      Solder Paste

      Our solder paste is a mixture of finely powdered solder alloy and flux, which is used for surface mount technology (SMT) applications. It is ideal for soldering small and complex electronic components, such as integrated circuits, resistors, and capacitors. Our solder paste comes in different types, such as leaded and lead-free, to meet the environmental and regulatory requirements of different countries.

      Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics Best Type 3 4 5 No Clean Rosin Flux Paste BGA Liquid Leaded Tin Lead Solder Paste for SMD Electronics

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