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Product ID: 68590139
T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
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Description
Basic Info.
- Model NO. Solder Paste
- Type Resin
- Melting Point 200℃-300℃
- Chemical Composition Tin Lead Silver Copper
- Function Remove Oxides, Protect Weld Metal, Make the Liquid Solder Flow
- Application SMT Soldering
- Manufacturing Method Smelting
- Alloy Lead Free
- Alloy 2 Sac305 Sn96.5Ag3.0Cu0.5
- Alloy 3 Sac0307 Sn99Ag0.3Cu0.7
- Alloy 4 Sn42Bi58 Low Temperature
- Powder Size Type 3: 25 to 45 Microns
- Powder Size 2 Type 4: 20 to 38 Microns
- Flux No Clean Flux
- Certificate RoHS
- Packing Jar
- Packing 2 Syringe
- Shipping Courier / Air Freight
- Shelf Life 6months
- Storage 0 to 10 Degree Celsius
- Application 1 SMD Soldering
- Application 2 SMT Soldering
- Transport Package Foam Box
- Specification 100g to 1000g
- Trademark XF Solder
- Origin China
- HS Code 3810100000
- Production Capacity 30tons/Month
Packaging & Delivery
- Package Size 10.00cm * 10.00cm * 10.00cm
- Package Gross Weight 1.500kg
Product Description
T3 T4 Sac305 Sn63pb37 Leaded Low Temp No Clean PCB Reflow Soldering BGA Ppd SMD SMT Lead Free Bismuth Silver Copper Tin Solder Paste for Electronics 63 37 42 58
We produce different types of solder paste:
- Lead Free Solder Paste: Sn96.5Ag3.0Cu0.5, Sn99Ag0.3Cu0.7, Sn42Bi58 etc
- Leaded Solder Paste: Sn63Pb37, Sn60Pb40, Sn50Pb50 etc
Applications of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
This solder paste SAC305 is primarily used for electronics manufacturing by surface mount technology (SMT) and through-hole soldering. Including:
- Consumer Electronics: It finds application in the production of consumer electronics such as refrigerators, smartphones, tablets, laptops, and gaming devices.
- Automotive Electronics: The solder paste is suitable for soldering critical components in automotive electronics systems.
How to use the Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305?
- Stencil Printing: Prepare the right stencil and apply solder paste SAC305 through the stencil onto designated solder pads on a printed circuit board (PCB).
- Place SMD components: Accurately place surface mount components onto the solder paste-covered pads. This can either be done by high accurate automatic SMT soldering machine, or manually placed by tweezers.
- Conduct the Reflow Soldering: Heat the assembled PCB to melt the paste and create secure solder joints during reflow soldering. For small DIY projects, using hot air gun to conduct the soldering is also workable.
Instruction on Storage and Using of Lead Free Solder Paste Sn96.5Ag3.0Cu0.5 SAC305:
- It is recommended to store at 2°C to 10°C to prevent paste drying or degradation.
- It's recommended to get the solder paste out of refrigerator 3 to 6 hours prior to using to get the paste come to the room temperature. Well mix the paste using a mixer machine or doing it manually by using spatula.
- Un-finished solder paste must be well seal up again in the airtight jars to prevent contamination and moisture absorption, and put back into the refrigerator.
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